PDF is excited to showcase the latest developments in our state-of-the art big data analysis platform – Exensio™ – at IC China 2015, 13th China International Semiconductor Expo & Summit in Shanghai. Come meet the PDF Solutions Asia team and learn how the Exensio platform is expanding even further across the product lifecycle, now including test and assembly solutions as well as cloud-based production and yield analysis.
Visit our booth for demos and product information, and to learn how customers are harnessing PDF Solutions’ technology to reap the benefits of higher yields, improved productivity at test and assembly, faster time-to-market, and reduced product and process variability.
Shanghai New International Expo Center (SNIEC) W5, booth #5C089
November 11-13, 2015
Thank you for your continued interest in our products and services. Please contact us with any questions at for the PDF Solutions Asia team at firstname.lastname@example.org or any general questions at email@example.com