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Fairchild Semiconductor Adopts PDF Solutions Exensio -Test Module For Global Test Operations

Jul 7, 2016 - San Jose, Calif. (PDF Solutions, Inc.)

Fairchild Improves Operational Efficiency and Yield Through Deployment of PDF Solutions’ Integrated Exensio Platform

PDF Solutions, Inc. (NASDAQ: PDFS), the leading provider of yield improvement technologies and services for the integrated circuit (IC) process life cycle, today announced that Fairchild Semiconductor has extended its existing PDF Solutions® Exensio  –Yield installation by adopting the Exensio  Test module. The decision came after PDF Solutions engaged with Fairchild in an extensive on-site pilot program, in which all the capabilities of the Exensio  Test module were demonstrated, giving Fairchild the ability to obtain the synergies from the integrated Exensio  Yield and Exensio  Test solutions.

“During the pilot phase, we were able to significantly improve our test operations efficiency and first pass yield using the Exensio dashboarding capability,” said Dr. Wei-Chung Wang, Fairchild Senior Vice President of Manufacturing Operations. “The number of units per day per tester improved by 30% on key, high-volume products. First pass yield improved 10-20% by direct retest and reprobe.”

PDF Solutions Exensio  Test module — augmented with new dashboarding capabilities that are designed to be powerful and easy-to-use, and with significantly enhanced integration within the Exensio  Test module and across the entire Exensio Platform — is designed to give Fairchild near real-time visibility and control of their test operations. “By leveraging the existing Exensio  Yield installation and focusing on integrating new and existing components of the Exensio  Test module, we were able to improve significantly both the overall efficiency and yield of Fairchild’s test operations,” stated Said Akar, General Manager of PDF Solutions’ Volume Manufacturing Solutions group. “Whereas other solutions focus on specific steps in the manufacturing process, our Exensio Platform solution is built to span the entire semiconductor manufacturing value chain, from in-fab processing through wafer-sort, assembly and final-test. This capability is designed to give customers unique insight by providing a much broader view of the factors driving yield.”

To learn more about the PDF Solutions Exensio Platform and how it can help your company improve efficiency and manufacturing yield, please contact

About the Exensio Platform

The Exensio platform is a big data analytics infrastructure designed to provide highly-scalable, high-performance infrastructure for storage, communication, automation and the handling of both industry-specific and PDF Solutions’ proprietary data types. Designed and developed specifically for the semiconductor industry, Exensio solutions have an installed base of more than 19,000 users at leading fabs, fabless and test and assembly houses around the world. Exensio modules built on the platform include: Exensio  Yield, Exensio  Control, Exensio  Test, Exensio  -Hosted and Exensio  –Char. The Exensio  Yield module provides yield management technology and, when used together with the Exensio  Control module that provides fault detection and classification (FDC), results in world-class variability control in manufacturing. The Exensio  Test module leverages integration and analysis technology that produces diagnostic and predictive information that can be used to further optimize semiconductor yields and operational performance. The Exensio  Hosted module is a SaaS (Software as a Service), cloud-based yield management system for fabless semiconductor companies that  provides  powerful characterization to accelerate new product introductions (NPI) and high visibility to test floor operation. The Exensio  Char  module drives extensive process characterization and benchmarking capabilities through electrical test chip infrastructure.

About PDF Solutions

PDF Solutions, Inc. (NASDAQ: PDFS) is the leading provider of yield improvement technologies and services for the IC manufacturing process life cycle. PDF Solutions offers solutions that are designed to enable clients to lower costs of IC design and manufacture, enhance time to market, and improve profitability by addressing design and manufacturing interactions from product design to initial process ramps to mature manufacturing operations. PDF Solutions’ Characterization Vehicle® (CV®) electrical test chip infrastructure provides the core modeling capabilities, and is used by more leading manufacturers than any other test chips in the industry. Proprietary Template layout patterns provide optimum area, performance, and manufacturability for designing IC products. Exensio is a big data analytics platform designed to provide highly-scalable, high-performance infrastructure for storage, communication, automation and the handling of both industry-specific and PDF Solutions’ proprietary data types. Headquartered in San Jose, Calif., PDF Solutions operates worldwide with additional offices in Canada, China, France, Germany, Italy, Japan, Korea, and Taiwan. For the Company’s latest news and information, visit

Characterization Vehicle, CV, PDF Solutions, and the PDF Solutions logo are registered trademarks of PDF Solutions, Inc. or its subsidiaries. Exensio and Template are trademarks of PDF Solutions, Inc. or its subsidiaries. Other trademarks used herein are the property of their respective owners.

© 2016 PDF Solutions, Inc.  All Rights Reserved.

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Tel: (408) 938-6457

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