Tessolve Also to Provide Engineering Support Services to PDF Solutions’ Exensio™ Platform Customers
PDF Solutions® Inc. (NASDAQ: PDFS), the leading provider of yield improvement technologies and services for the integrated circuit (IC) process life cycle, announced today it has entered into a resale and quality assurance agreement with Tessolve, a leading semiconductor engineering services provider. Tessolve will engage in the sale of the Exensio-Test, Exensio-Yield and Exensio-Control solutions and provide services to Exensio customers. Additionally, Tessolve will provide quality assurance services to PDF Solutions in connection with the continuing development of the Exensio platform.
Tessolve’s team has extensive experience providing test engineering solutions to leading companies in the semiconductor industry. In the last 11 years they have built engineering expertise that is focused on decreasing their customers’ time to market by providing innovative test solutions and services. Tessolve has a strong presence in Southeast Asia, the predominant region for assembly and test. This, combined with their domain knowledge in backend semiconductor manufacturing, will strengthen PDF Solutions’ already expansive global reach to serve its customers’ manufacturing needs with the Exensio platform.
“The low defectivity requirements of today’s semiconductor devices not only necessitate advanced algorithms and analytics to identify and eliminate high risk parts, but the aggressive time-to-market pressures also dictate the urgency to understand and act on data,” commented Said Akar, General Manager of PDF Solutions’ Volume Manufacturing Solutions. “The relationship with Tessolve will enable us to provide best-in-class software and service solutions, with the necessary functionality and requirements for these challenging environments. Together we will better enable our global customer base to meet its quality, production, and time-to-market needs.”
“This strategic relationship with PDF Solutions is an exciting endeavor for our company. Our services combined with the Exensio platform will help us provide an extremely comprehensive solution for IC manufacturers,” said Raja Manickam, Chief Executive Officer, Tessolve. “We look forward to working with such a talented and reputable company.”
To learn more about PDF Solutions, Exensio, or to contact Tessolve, write to email@example.com.
The statements in this press release regarding the success of the sales strategy, specifically, and the strategic relationship, generally, as well as the quality and future development of products and services are forward looking and are subject to events and circumstances of the future. Actual results could differ materially from those expressed in these forward-looking statements. Risks and uncertainties that could cause results to differ materially include risks associated with continued development, support, and market acceptance, and other risks set forth in PDF Solutions’ periodic public filings with the Securities and Exchange Commission, including, without limitation, its Annual Reports on Form 10-K, most recently filed on March 3, 2015, for the year ended December 31, 2014, Quarterly Reports on Form 10-Q, most recently filed on August 3, 2015, for the quarter ended June 30, 2015, and Current Reports on Form 8-K and amendments to such reports. The forward-looking statements made in this press release are made as of the date hereof, and PDF Solutions does not assume any obligation to update such statements or the reasons why actual results could differ materially from those projected in such statements.
About PDF Solutions
PDF Solutions, Inc. (NASDAQ: PDFS) is the leading provider of yield improvement technologies and services for the IC manufacturing process life cycle. PDF Solutions offers solutions that are designed to enable clients to lower costs of IC design and manufacture, enhance time to market, and improve profitability by addressing design and manufacturing interactions from product design to initial process ramps to mature manufacturing operations. PDF Solutions’ Characterization Vehicle® (CV®) electrical test chip infrastructure provides the core modeling capabilities, and is used by more leading manufacturers than any other test chips in the industry. Proprietary Template™ layout patterns provide optimum area, performance, and manufacturability for designing IC products. Exensio-Yield provides world-class variability control in manufacturing by leveraging PDF Solutions’ industry-leading yield management technology and fault detection and classification (FDC) with Exensio-Control software. Exensio-Test leverages integration and analysis technology that produces diagnostic and predictive information that can be used to further optimize semiconductor yields. Headquartered in San Jose, Calif., PDF Solutions operates worldwide with additional offices in Canada, China, France, Germany, Italy, Japan, Korea, and Taiwan. For the Company’s latest news and information, visit http://www.pdf.com/.
Characterization Vehicle, CV, dataConductor, PDF Solutions, and the PDF Solutions logo are registered trademarks of PDF Solutions, Inc. or its subsidiaries. Exensio, Template and YieldAware are trademarks of PDF Solutions, Inc. or its subsidiaries. Other trademarks used herein are the property of their respective owners.
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