Menu
Close
  • Why PDF Solutions
  • Products
    • Exensio® Analytics Platform
    • Advanced Insights for Manufacturing
    • Design-for-Inspection™ System
    • Characterization Vehicle® System
    • Cimetrix® Connectivity & Control
    • Cimetrix Sapience® Platform
    • Technology
    • Partners
  • Services
    • Overview
    • Integrated Yield Ramp
    • Professional Services
    • Value Added Services
  • Resources
    • All Resources
    • Published Papers
    • News & PR
    • Events
    • Applications
    • Training
  • Company
    • Overview
    • Management Team
    • Board of Directors
    • Corporate Governance
    • Careers
    • Investor Relations
    • Locations
    • Trust Center
  • Support
    • Overview
    • Support Portal
    • Software Downloads
  • Contact
  • Schedule A Demo
  • Login
  • Support
    • Overview
    • Support Portal
    • Software Downloads
  • Contact
  • Schedule A Demo
Login below to view protected resources.

Lost your password?
Forgotten Password
Cancel
  • Why PDF Solutions
  • Products
    • Exensio® Analytics Platform
    • Advanced Insights for Manufacturing
    • Design-for-Inspection™ System
    • Characterization Vehicle® System
    • Cimetrix® Connectivity & Control
    • Cimetrix Sapience® Platform
    • Technology
    • Partners
  • Services
    • Overview
    • Integrated Yield Ramp
    • Professional Services
    • Value Added Services
  • Resources
    • All Resources
    • Published Papers
    • News & PR
    • Events
    • Applications
    • Training
  • Company
    • Overview
    • Management Team
    • Board of Directors
    • Corporate Governance
    • Careers
    • Investor Relations
    • Locations
    • Trust Center
en English
zh-CN Chinese (Simplified)en Englishja Japanese
Products

Advanced Insights for Manufacturing

Machine Learning + Decades of Experience

PDF Solutions enables companies to reap the benefits of Industry 4.0 by combining a big data infrastructure and machine learning applications with decades of manufacturing and test experience to provide customers with solutions tailored to deliver achieve specific outcomes.


Proven in High-Volume Production

Our Advanced Insights for Manufacturing, or AIM, is a configurable, knowledge-based system that learns from on-going calculations and user inputs to rapidly make intelligent decisions in a high-volume production environment. Over the past decade, we have developed a family of production-proven AIM Solutions that leverage our big data and machine learning capabilities to deliver significant ROI to customers in the areas of manufacturing, test operations, and assembly & packaging.


AIM Solutions Overview:

Adaptive Signature Diagnostics (ASD)

ASD is an automated system for anomalous wafer yield signature detection, classification and root cause analysis. Incoming new wafers are analyzed for spatial signatures and classified into categories that are refined on-the-fly using machine learning based on user inputs, a technique we call Collaborative Learning. Drilldown analyses are automatically performed for each unique wafer category and reports are generated that confirm re-emergence of known root causes or highlight new potential sources of wafer yield loss.

ROI: Root causes of wafer yield loss are identified and contained 5x faster than conventional analytical techniques and expert knowledge is captured in machine learning models for continuous improvement.

Data Sources: Wafersort/Binsort, PCM, LEH/WEH, Metrology, Defect, Tool FDC

Screenshot of ASD solution


Capacity and Efficiency Improvement (CEI)

CEI leverages the Equipment Performance Tracking (EPT) capabilities within the Exensio Analytics Platform in a step-by-step methodology to optimize OEE (overall equipment effectiveness), fab capacity and wafer throughput by matching tools and chamber operations. Data collected from each recipe micro-step captures any performance mismatches between tools which are then eliminated through a detailed analysis of tool FDC data.

ROI: 10% improvement in bottleneck tool capacity, >20% improvement in efficiency/throughput, fast identification of recipe vs. setup and equipment hardware issues impacting deviation from manufacturing throughput model.

Data Sources: Tool sensor FDC data


Consumable Cost Reduction (CCR)

The CCR solution utilizes the eBOM dataset collected by the Process Control module (a core module of the Exensio Analytics Platform) which includes ERP, MES, EAM, and FAC data as well as consumables, maintenance parts and materials, and chemical and material composition reports, to systematically reduce material consumption, optimize usage, and catch material composition excursions. Poor performing tools, parts, and suppliers are identified through structured analytic workflows, guiding the user through the optimization process.

ROI: Reduce material consumption costs, reduce yield and reliability excursions and optimize parts and material usage

Data Sources: Consumable batch ID, Event data, Recipe ID, FDC data, PM information, Material Composition reports, MES data


Early Life Failure Detection (ELF)

The ELF solution optimizes cost-of-quality tradeoffs between yield and reliability failure in the field.  Classical outlier algorithms, such as “Part Average Testing” (PAT) are often used to identify and screen parts with a risk for early life failure.  Exensio’s ELF goes beyond PAT and provides a comprehensive die quality grading and risk classification solution by taking advantage of the Exensio Analytics Platform’s end-to-end database and infrastructure.  Advanced indicators generated from multiple data sources are analyzed with a multi-variate machine learning approach that adapts as new information comes to light (e.g. 8D reports, root causes found in FA, additional incoming RMA’s, etc.).

ROI: Prevent quality and reliability escapes by detecting high risk die at Wafer Sort

Data Sources: Wafer Sort, Final Test, PCM, Burn-in, Returns, Defect, Metrology, LEH/WEH, FDC


Equipment Trouble Protection (ETP)

ETP is the next generation FDC solution for wafer fabs and assembly floors.  Going beyond the standard approach of FDC data collection, feature selection and SPC alarm limits, ETP links FDC data with tool events and uses AI and ML to detect and classify abnormal equipment sensor traces into good vs. bad vs. unknown.  The classification system adapts as users judge new signals and identify root causes, enabling fast issue detection and containment.

ROI: +1% DPW Yield, +5% Fab Output, +2% Line Yield, +2% Tool Availability, Engineering FTE savings

Data Sources: Tool sensors FDC data and tool events


Intelligent Material Disposition (IMD)

A “Material Review Board” (MRB) is a common technique used to improve the quality of shipped product.  The IMD solution dramatically reduces the manual work and frequency of human-induced variability in the MRB process.  Automated workflows are implemented that capture the specific quality criteria of each customer’s business and product line to provide lot and wafer quality grading in minutes, rather than hours or days.  Comprehensive analytics and full automation ensure uniform results and high quality decision making.

ROI: Reduces engineering effort for lot disposition by >50%. Prevents escapes, improves consistency, and decision quality of wafer dispositioning.

Data Sources: PCM/WAT, Wafersort/Binsort, Final Test


Smart Testing

Manufacturing complexity, advanced packaging technology, and high density chip designs conspire to drive up the cost of wafersort and final test.  Exensio’s Smart Testing solution uses Machine Learning to find subtle signals in the massive data set associated with each product die and applies Artificial Intelligence to modulate test flows and achieve higher product quality at lower cost.  The AI / ML approach identifies the highest quality die as candidates to skip expensive test insertions such as Burn-in, optimizing test cost while still meeting DPPM requirements.  PDF can provide the machine learning algorithm, or you can provide your own.  The system is designed for production operation, installed on your OSAT’s test floor “at the edge” for efficient, low latency operation, high uptime and minimal data loss.

ROI: Reduces burn-in requirements by 30-60%, saving up to millions of dollar per year depending on volume and cost of test.

Data Sources: PCM/WAT, Wafersort, Final Test, (and Metrology, Defect, MES, and FDC data as available)


Yield Aware FDC

YA-FDC is a combination of technology and services that leverages Exensio’s “big data” platform to improve process variation, identify equipment conditions and sources of variability that influence functional and parametric yield, and set appropriate SPC limits with proprietary analysis and modeling techniques that identify critical parameters.  Analysis is automated with reporting and dashboards to drive fast improvement yield, variation and excursions.  AI / ML provides predictive models to for finer feedback and feed-forward control, predictive PM’s to optimize tool availability and Virtual Metrology for adaptive inline sampling.

ROI: +8% yield improvement, +40% excursion reduction, +7% faster NPI ramp learning rate

Data Sources: Tool sensor FDC data, Metrology, Defect, PCM/WAT, Wafersort, Test, Assembly

  • Exensio® Analytics Platform
    • Overview
    • Products
      • Exensio IDM
      • Exensio Fabless
      • Exensio Foundry
      • Exensio OSAT
    • Modules
      • Manufacturing Analytics
      • Process Control
      • Test Operations
      • Assembly Operations
  • Advanced Insights for Manufacturing
  • Design-for-Inspection™ System
  • Characterization Vehicle® System
  • Cimetrix® Connectivity & Control
  • Cimetrix Sapience® Platform
  • Technology
    • Overview
    • DEX (Data Exchange Network)
    • Machine Learning
    • Cloud
  • Partners
  • Exensio® Analytics Platform
    • Overview
    • Products
      • Exensio IDM
      • Exensio Fabless
      • Exensio Foundry
      • Exensio OSAT
    • Modules
      • Manufacturing Analytics
      • Process Control
      • Test Operations
      • Assembly Operations
  • Advanced Insights for Manufacturing
  • Design-for-Inspection™ System
  • Characterization Vehicle® System
  • Cimetrix® Connectivity & Control
  • Cimetrix Sapience® Platform
  • Technology
    • Overview
    • DEX (Data Exchange Network)
    • Machine Learning
    • Cloud
  • Partners

Ready to apply ML in your production environment?

To see a demonstration of any of our AIM solutions, click the button to the right to schedule a personal demo!

Schedule A Demo

Corporate Headquarters
2858 De La Cruz Blvd.
Santa Clara, CA 95050 USA

Phone: 408-280-7900

Fax: 408-280-7900

Email: info@pdf.com

Follow Us on Social Media

  • Facebook
  • Twitter
  • LinkedIn
  • Instagram

© 2023 PDF Solutions. All rights reserved.

  • Privacy Policy
  • Terms of Service
  • Sitemap
This website uses cookies to improve your experience. We'll assume you're ok with this, but you can opt-out if you wish. Cookie settingsACCEPT
Privacy & Cookies Policy

Privacy Overview

This website uses cookies to improve your experience while you navigate through the website. Out of these cookies, the cookies that are categorized as necessary are stored on your browser as they are essential for the working of basic functionalities of the website. We also use third-party cookies that help us analyze and understand how you use this website. These cookies will be stored in your browser only with your consent. You also have the option to opt-out of these cookies. But opting out of some of these cookies may have an effect on your browsing experience.
Necessary
Always Enabled
Necessary cookies are absolutely essential for the website to function properly. This category only includes cookies that ensures basic functionalities and security features of the website. These cookies do not store any personal information.
Non-necessary
Any cookies that may not be particularly necessary for the website to function and is used specifically to collect user personal data via analytics, ads, other embedded contents are termed as non-necessary cookies. It is mandatory to procure user consent prior to running these cookies on your website.
SAVE & ACCEPT