Exensio Fabless - OSATs Testing, Assembly and Packaging

For fabless semiconductor companies who design their devices but rely on OSATs for test, assembly and packaging

This product includes the following three modules: Manufacturing Analytics, Test Operations, and Assembly Operations

Exensio Fabless collects and aligns data from their OSATs to provide product lifecycle data from test and assembly operations. As with all Exensio products, product lifecycle data is automatically collected through our DEX infrastructure and is immediately harmonized and ready for interactive analysis or to drive machine-learning algorithms.

With Exensio Fabless, customers can implement powerful rules-driven flows that raise product quality and improve test efficiency across their entire supply chain.

Download the Exensio Fabless Datasheet

Focus on Your Product, not Data Management

With Exensio Fabless, customers can focus their time and effort on the quality and robustness of their products and not worry about data collection and management. Our DEX infrastructure ensures that all OSAT test data is collected, cleaned and is ready for interactive or automated analysis within minutes of test completion.

In the example below, a product engineer is interested in the parameter NFPT and is running a char report against both temperature and voltage. In the upper right, is a comparison circle chart to see how the device performs at different temperatures. The Exensio Fabless dashboard can easily display information in multiple formats including box plots, summary tables, histograms and CDF plots.

All of this information can be displayed quickly and easily, and with the reporting module, automatically be turned into report, further reducing engineering time and effort on tasks that can be automated with Exensio Fabless.

Know What to Focus on Every Day

When in high volume production, product engineers are always worried about what can go wrong next. Using the dashboards in Exensio Fabless it is easy to see what the status is for any product and to drill down where necessary to understand what the issue may be.

In the example below, the product engineer is looking at device yield for multiple lots over the past several days. At any time the user can select one or more lots (indicated by the purple selection area) and drill down into those lots for more information such as which tester was used, retest counts and more.

Exensio Fabless tightens the connection between fabless semiconductor companies and their OSATs, creating a single point of truth for all of their product data. For most data analysis projects, it is estimated that 80% of engineering time is spent, just preparing data for analysis. By reducing that effort to zero, Exensio Fabless effectively provides a 5x boost in engineering productivity. Product engineers can now focus their time and energy on solving problems that improve yield and throughput, and zero time on low value tasks like data collection and management.

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