Single Device Traceability

Because Exensio IDM is a true end-to-end product for semiconductor manufacturing, it includes not just manufacturing and test data, but also assembly and packaging data via the Assembly Operations module [link to the assembly operations module page]. In this dashboard, the user is looking at FT and assembly data. On the left is the FT bin pareto with failure bin codes 106,  107 and 108. In the top right is the summary data for all the trays and in the bottom right are the individual trays showing the locations of the good parts and failing parts.

With Assembly Operations data integrated with Test Operations data, users can achieve single die traceability without requiring ECIDs due to the mapping capabilities provided by Assembly Operations, a key requirement in many regulated industries such as automotive and medical as well as quality-sensitive commercial markets.


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