Resources
Yield/Characterization
EDTM 2022 – Novel E-beam Techniques for Inspection and Monitoring
EDTM 2022 – New Method for BEOL Overlay and Process Margin Characterization
NANOTS 2021 – Advanced High Throughput e-Beam Inspection with DirectScan
IEEE S3S 2019 – Characterization Challenges and Solutions for FDSOI Technologies
IEEE JEDS 2019 – Design and Measurement Requirements for Short Flow Test Arrays to Characterize Emerging Memories
EDTM 2019 – Yield and Reliability Challenges at 7nm and Below
EDTM 2019 – Design and Measurement Requirements for Short Flow Test Arrays to Characterize Emerging Memories
IEEE Transactions 2015 – Contact Chains for FinFET Technology Characterization
IEEE Transactions 2008 – Variation in Transistor Performance and Leakage in Nanometer-Scale Technologies
ICMTS 2006 – Scribe Characterization Vehicle Test Chip for Ultra-Fast Product Wafer Yield Monitoring
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