Exensio Design for Inspection (DFI) Data Sheet
The Design-for-Inspection™ (DFI) System by PDF Solutions offers a cutting-edge solution for identifying buried electrical defects in semiconductor 3D structures. Using a contactless e-beam measurement system, the DFI System detects electrically relevant defects during middle-of-line manufacturing, scanning hundreds of millions of devices per hour.
With proven success across 120+ tape-outs (from 28nm to 5nm), the system accelerates time-to-market by 4-6 months while providing early visibility into potential reliability risks. Discover how the DFI System enhances yield, performance, and product reliability.
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