How design is changing with the shift from homogeneous ICs to heterogeneous, multi-chip packages
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Leaders can accurately predict outcomes, long before others even recognize a trend is occurring. Semiconductor manufacturing success in the era of cloud computing and Industry 4.0 requires the ability to integrate data across the entire product lifecycle and apply predictive analytics at the edge to positively impact future outcomes such as yield, quality, and reliability.
The Exensio® analytics platform supports over 50 different data formats from FDC, Test, Assembly, and Packaging and harmonizes all of that data into a high-performance semantic model in the cloud or on-premise that is immediately ready for interactive analytics and machine-learning applications, transforming data into actionable intelligence that improves yield, quality, and profitability.
All ProductsSpend time finding answers instead of collecting and cleaning your data
Accelerate time to market for all your products
Meet aggressive quality goals without sacrificing yield
PDF Solutions provides additional offerings to help customers achieve specific outcomes. These solutions include the use of Machine Learning (e.g. predicting Early Life Failures), Characterization Vehicles® to accelerate yield learning for advanced process nodes and derivative legacy nodes, and next-generation Design For Inspection™ solutions that identify critical electrical manufacturing issues months before any other methodologies.
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Dr. Wei-Chung Wang Fairchild Sr. VP of Manufacturing Operations"We were able to significantly improve our test operations efficiency and first pass yield using the Exensio dashboarding capability”
Bob Lima Director of Assembly and Test Operations at Peregrine Semiconductor“We look forward to leveraging the entire Exensio platform with the Exensio-Yield and Exensio-Control modules, to optimize our chip yields and realize its direct positive impact on our profitability.”
Kevin Haskew Sr VP and CIO at ON Semiconductor"The new features and the single platform approach of Exensio are critical for the success of our new product introductions, enabling us to drive our manufacturing process to higher yields, higher efficiency, and help our customers get to market quickly.”
Thorsten Widmer Vice President of Semiconductor Plant at Robert Bosch GmbH"After benchmarking the current market offers and testing a real implementation of mæstria® in our Reutlingen facility, we drew the conclusion that mæstria® is the best adapted FDC solution to our fabrication environment."
Walter Mente Vice President Operations at austriamicrosystems"After an extensive evaluation and actual usage, we found mæstria® and dataPOWER® to be the best stand-alone FDC and YMS products on the market today."
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