This allows us to extend our innovative solutions for time-to-market, yield, quality, and operational efficiencies into new applications and users. Visit our partners page to learn more.
Visit Page
Leaders can accurately predict outcomes, long before others even recognize a trend is occurring. Semiconductor manufacturing success in the era of cloud computing and Industry 4.0 requires the ability to integrate data across the entire product lifecycle and apply predictive analytics at the edge to positively impact future outcomes such as yield, quality, and reliability.
The Exensio® analytics platform supports over 50 different data formats from FDC, Test, Assembly, and Packaging and harmonizes all of that data into a high-performance semantic model in the cloud or on-premise that is immediately ready for interactive analytics and machine-learning applications, transforming data into actionable intelligence that improves yield, quality, and profitability.
All ProductsSpend time finding answers instead of collecting and cleaning your data
Accelerate time to market for all your products
Meet aggressive quality goals without sacrificing yield
PDF Solutions provides additional offerings to help customers achieve specific outcomes. These solutions include the use of Machine Learning (e.g. predicting Early Life Failures), Characterization Vehicles® to accelerate yield learning for advanced process nodes and derivative legacy nodes, and next-generation Design For Inspection™ solutions that identify critical electrical manufacturing issues months before any other methodologies.
Services
Kevin Haskew Sr VP and CIO at ON Semiconductor"The new features and the single platform approach of Exensio are critical for the success of our new product introductions, enabling us to drive our manufacturing process to higher yields, higher efficiency, and help our customers get to market quickly.”
Shao Zexu VP of Process and IP Strategy at SmartSens“Exensio Fabless enables our product engineering organization to achieve new levels of excellence in data analytics for all of our product lines."
Feng Jun Director of Product Integration at GigaDevice"I believe that Exensio Fabless can provide our engineers with the most efficient and accurate data analysis capabilities.”
Gino Nys Quality Improvement Product Manager at Melexis“Exensio Fabless, and specifically the Manufacturing Analytics capability, really helped to break down data barriers internally across Melexis."
Colin O’Brien Engineering Director at Infinitesima“We were able to get our Metron3D product to market much faster because of the Cimetrix CIMControlFramework software and the professional services team.”
Thorsten Widmer Vice President of Semiconductor Plant at Robert Bosch GmbH"After benchmarking the current market offers and testing a real implementation of mæstria® in our Reutlingen facility, we drew the conclusion that mæstria® is the best adapted FDC solution to our fabrication environment."
Walter Mente Vice President Operations at austriamicrosystems"After an extensive evaluation and actual usage, we found mæstria® and dataPOWER® to be the best stand-alone FDC and YMS products on the market today."
Myles Blake Business Information Director at Plessey Semiconductors"The speed at which we can automate our line using Cimetrix Sapience has become dramatically apparent."
Bob Lim Director of Assembly and Test Operations at Peregrine Semiconductor“We look forward to leveraging the entire Exensio platform with the Exensio-Yield and Exensio-Control modules, to optimize our chip yields and realize its direct positive impact on our profitability.”
Dr. Wei-Chung Wang Sr. VP of Manufacturing Operations at Fairchild"We were able to significantly improve our test operations efficiency and first pass yield using the Exensio dashboarding capability”
English
Chinese (Simplified)
Japanese