Enabling Innovators to Fast-Track Next-Gen IC Designs to Production – Download

In this presentation, Ken MacWilliams, President of Multibeam, introduces the world’s first high-productivity electron beam (eBeam) lithography system designed to fast-track next-generation IC designs from the lab to volume production. The session details how Multibeam’s DirectScan technology addresses critical industry inflections, including heterogeneous integration, silicon photonics, and quantum computing by delivering 100x higher productivity than legacy single eBeam systems. MacWilliams explores the system’s ability to facilitate rapid prototyping and manufacturing of purpose-built custom chips, leveraging Cimetrix connectivity standards for optimized process control and seamless factory integration.

Download the full presentation to learn how DirectScan enables wafer-scale interposers and high-density interconnects while significantly reducing time-to-market.