Exensio New Features & Roadmap for Fabs and Advanced Packaging – Download
This presentation by Jon Holt outlines PDF Solutions’ 2025 roadmap and strategic focus on creating scalable, data-intelligent, and secure platforms for the semiconductor industry. Key highlights include the introduction of Sapience Supply Chain Solutions for unified supply chain orchestration, the integration of Exensio ModelOPS for advanced AI/ML deployment, and new vision-intelligence capabilities for defect classification. The presentation details how these innovations address critical industry needs—such as AI scalability, 3D complexity, and zero-trust security—while introducing enhanced data models and bulk strategy management tools to optimize manufacturing efficiency and yield.
Download the full presentation to explore a more detailed roadmap and technical specifications.
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