Leveraging PDF Exensio for Intel Advanced Packaging and Test – Download
In advanced packaging and testing, the volume of data generated daily presents a significant challenge for data standardization and analysis. In this presentation, Syed Baquar, Principal Engineer at Intel, details how Intel uses the PDF Exensio® platform to manage and analyze manufacturing data throughout the process, from wafer fabrication to final testing. Learn about specific use cases, including traceability, yield tracking, defect analysis, and how Intel leverages the Exensio platform’s integrated analytics to lower the mean time to detect and resolve issues.
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