AI for Manufacturing and Test -The New Frontier Keynote Presentation at SEMICON Taiwan 2025
Speaker: Ming Zhang, PDF Solutions
Abstract:
The semiconductor industry stands at a pivotal moment, driven by the transformative forces of AI and chiplet technology. AI applications demand the seamless heterogenous integration of diverse chiplets: compute, memory, communication, and sensing. At the same time, the exponential growth in systemic complexity of chiplet-based designs generates an unprecedented volume of data across the design, manufacturing, and deployment phases of semiconductor products. This convergence presents a unique and vast opportunity to harness the power of data, through AI in semiconductor manufacturing and testing while posing significant challenges due to the distinct nature of semiconductor data. A number of technologies are coming together to increase the impact that AI can have on semiconductor manufacturing. Secure remote connections to equipment allow multiple parties to leverage equipment data to better optimize tools and processes leveraging AI based digital twin technology. Emerging Agentic AI approaches can deliver major improvements to process controls in particular when combined with LLM based AI for dramatic improvements in knowledge management for optimized incident response.
This presentation explores the evolving industry landscape, outlines our vision for leveraging AI in the manufacturing and testing of chiplets and systems, and addresses the critical challenges that remain in this exciting frontier.
Keywords: AI for Test, Data Feed Forward, AI techniques for modeling with low-volume data sets
Download the presentation today!
By downloading this information, I agree that PDF Solutions, Inc. may use my information provided herein to contact me about its products and services, even if I have previously unsubscribed from such communications. For information on our privacy practices and commitment to protecting your privacy, please review our Privacy Policy.