Posted on Semiconductor Engineering: Click here to view original article
By: Ed Sperling
3D chips and multi-die assemblies can offer significant improvements in performance and power, but the tradeoff is the increased amount of time and money it takes to generate working silicon. There are more process steps, more interactions between processes, and more data to manage throughout the manufacturing flow — so much, in fact, that it has now reached well beyond what even the best engineers can manage. This is where agentic AI can really shine. John Kibarian, CEO of PDF Solutions, talks about how AI agents fit into this picture, how they can shorten time to market by completely removing humans from some interactions, and how this can improve data security in a multi-vendor environment.