The New Frontier: AI for Manufacturing and Test Keynote Presentation
Speaker: Marc Jacobs, Sr. Dir. Of Fabless Solution, PDF Solutions
Abstract:
Today, the industry faces accelerating innovation—3D architectures, chiplets, and sophisticated hybrid packages—while navigating increasingly complex supply chains. Simultaneously, AI promises to revolutionize semiconductor design and manufacturing, creating unprecedented efficiency gains across all levels.
This presentation will touch on the evolving industry landscape, sharing several AI use cases being executed in test today. We plan a deep dive into the architecture required to support scaling AI from Pilot Production to High Volume Manufacturing (HVM). We will also address challenges in securely handling and staging data across multiple geographies and companies to make executing the model possible. Next, we will cover the challenge of “time domains” as engineers need to decide whether a model should run offline, near-real-time, or ultra-real-time to most effectively achieve customer use case goals. Finally, we will share several real-world production examples such as Predictive Binning, Predictive Burn-In, Adaptive Test, and Analog Trim.
Keywords: AI for Test, Data Feed Forward, AI techniques for modeling with low-volume data sets
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