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Published Papers
Published Papers
Published Paper
2025-Full Wafer Inspection for Voltage Contrast Systematic Defects Using High-Throughput Point Scan
Published Paper
2025-Stress-related Local Layout Effects in FinFET Technology and Device Design Sensitivity
Published Paper
2025-Product Design Enhancement with Test Structures for Non-Contact Detection of Yield Detractors
Published Paper
2025-The Overview of Silicon Carbide Technology: Status, Challenges, Key Drivers, and Product Roadmap
Published Paper
2025-Full-chip Voltage Contrast Inference Using Deep Learning; You Only Look Once: Voltage Contrast (YOLO-VC)
Published Paper
2024 – Expediting manufacturing safe launch with Big Data AI/ML analytic solutions on the cloud
Published Paper
EDTM 2022 – Novel E-beam Techniques for Inspection and Monitoring
Published Paper
EDTM 2022 – New Method for BEOL Overlay and Process Margin Characterization
Published Paper
NANOTS 2021 – Advanced High Throughput e-Beam Inspection with DirectScan
Published Paper
APCSM 2020 – Combining Machine Learning with Advanced Outlier Detection to Improve Quality and Lower Cost
Published Paper
IEEE S3S 2019 – Characterization Challenges and Solutions for FDSOI Technologies
Categories
Tags
- AI/ML
- AI Driven Test
- OEE
- Chiplet ecosystem
- DFF
- Agentic AI
- Supply Chain
- Predictive Learning
- FDC
- Emerging Memories
- Parametric Test
- Data
- Compound Semiconductors
- Process Control
- Manufacturing
- Electric vehicles
- Design for Manufacturing
- Characterization
- Modeling
- Voltage Contrast
- e-Beam
- Yield Management
- Silicon Carbide
- Manufacturing Analytics
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