AI-Driven Innovation in the Semiconductor Industry – Download

This presentation, delivered by Michael Campbell of Qualcomm, provides a comprehensive analysis of how artificial intelligence is reshaping semiconductor manufacturing and supply chain management. It explores the transition from traditional Design and Technology Co-Optimization (DTCO) to System and Technology Co-Optimization (STCO), highlighting the need for “Agentic AI” to address next-generation challenges such as thermal management, interconnect density, and yield optimization. By examining real-world case studies in post-silicon fault grading and supply chain planning, the document outlines a strategic roadmap to overcome organizational implementation challenges and avoid common pitfalls in AI adoption.

Download the full presentation to gain critical insights into monetizing data, connecting siloed analytics, and leveraging AI as a true business enabler.