Exensio Foundry

The majority of existing solutions focus on process- and site-centric defect and yield management deployments. Exensio® enables end-to-end deployments across geographically dispersed sites, breaking data silos and allowing various teams to look at the same data in real time.

Defect data is readily tied to the final product yield, spanning multiple factories, running on different MES, using different material tracking systems, supporting complex material flows. Rather than improving the local yield by single percentage digits, this allows major yield improvements or 10% or higher. In cases such as compound semiconductors, where the end-to-end yields are significantly lower, improvements of 30% or more have been observed.

Automation and reporting capabilities enable excursions in defectivity trigger alarms which can be sent to the MES or as emails to predefined user groups. This allows catching excursion events within hours rather than days, leading to timely mitigation actions. Aside from saving millions of dollars, it protects valuable infrastructure against disasters that can spread widely unless locally contained.

Alignment of all manufacturing data in one platform saves substantial costs on troubleshooting field returns. The ability to follow complex material flows from the final assembly to the fab wafer start makes the task of failure analysis a breeze. RMA analysis time reduction from weeks to hours have been reported by customers.

Decades of experience in data integration

• Defect data readers for all major defect formats (KLARF, ECD, RRF, etc…)
• Loading meta-data: Product, Fab, Technology, Process or other data types
• Parallel loading capabilities with both on-prem and cloud deployments
• Support for genealogy and wafer-level-traceability incl. changing wafer ID’s

Powerful Visualizations, Marking, Selection & Analysis Tools

• Defect maps visualizations using best-in-class data wrangling tools
• Overlays with electrical test data (binmaps) and display of summaries
• Calculation of statistics by defect classes: Kill Ratio, Capture Rate, Hit Rate
• Layer-to-layer registration for defect source analysis (DSA)
• Automated wafer- and lot-level summaries and statistics
• Provided with an extensive library of analysis templates for faster learning and adoption

Sampling and Classification of Defects

• Sampling of defects for visualizations and export for further analysis
• Operator-based image classification tools with database updates
• Ability to import custom user-defined defect classes

Image Gallery

• Support for a variety of image formats: TIFF, JPEG, PNG, BMP and more
• Defect image gallery with standard image adjustment techniques
• Customizable overlays of images with defects in wafer maps

Exensio visualizations Powered by TIBCO

The software comes with additional capabilities in support of compound semiconductor use cases (e.g. SiC and GaN). Download here or reach out to us for more information.